Hongxuan Zhang

Hongxuan Zhang is from Austin United States of America. Hongxuan is currently Electrical Engineering Fellow; EE/SW Team lead at Varian. In Hongxuan's previous role as a System Architect; Sr. Staff Engineer at Abbott, Hongxuan worked in until Sep 2021. Prior to joining Abbott, Hongxuan was a Electrical Architect at Thermo Fisher Scientific and held the position of Electrical Architect. Prior to that, Hongxuan was a Staff. Hardware and Electrical Engineer at Smith & Nephew from Dec 2015 to Sep 2019. Hongxuan started working as Staff. HW Engineer at Siemens Medical Solution, Chicago, USA in Jan 2009. From Dec 2006 to Dec 2008, Hongxuan was Sr. HW Engineer at Siemens Medical Solutions, Chicago, USA. Prior to that, Hongxuan was a HW and electrical engineer at EP Medsystem (St. Jude Medical), NJ, USA from Dec 2005 to Dec 2006. Hongxuan started working as Research Collaborator (ECG, EP, EEG), PI on NIH grants at Johns Hopkins University, Baltimore, USA in Dec 2003.