Ilya Erofeev
About
Ilya Erofeev is from Jerusalem, Israel. Ilya works in the following industries: "Telecommunications". Ilya is currently Senior HW Design Engineer at Indoor Robotics, located in Tel Aviv, Israel. In Ilya's previous role as a Printed Circuit Board Design Engineer at hiSky Ltd., Ilya worked in Rosh Haayin, Israel until Apr 2022. Prior to joining hiSky Ltd., Ilya was a HW Engineer (R&D Department) at Integrity Applications (IGAP) and held the position of HW Engineer (R&D Department) at Ashdod, Israel. Prior to that, Ilya was a Head of Electrical Engineering Department at Axel, based in Moscow from Jun 2014 to Aug 2016. Ilya started working as Lead Electronic Engineer (R&D Department) at RSC Technologies in Moscow in Aug 2012. From Mar 2009 to Aug 2012, Ilya was Senior Electronic Engineer (R&D Department) at Byterg, based in Moscow. Prior to that, Ilya was a Electronic Engineer (R&D Department) at Russian Federation State Research Center Institute of Biomedical Problems RAS, based in Moscow from Jan 2004 to Dec 2008.
You can find Ilya Erofeev's email at finalscout.com. FinalScout is a professional database with business professional profiles and company profiles.
Ilya Erofeev's current jobs
Ilya Erofeev's past jobs
• Participation in the planning of the company's strategy. • Problem statement to group of PCB design and embedded software engineers and control of time and quality compliance • Development of schedules which accurately reflect the project milestones and adhere to them • Participated in the co-design of surface and downhole solutions with other departments • Interaction with PCB suppliers and PCB assemblers to design for manufacturability and reduce time and cost of manufacturing • Development of Schematic, high-tech PCB layout and mechanical parts for harsh environment in MWD area • Design and maintain Altium database, development of design drawings and Requirement Specifications
• Interaction with PCB productions, PCB assemblers and components suppliers to design for manufacturability and reduce time and cost of manufacturing • Problem statement to group of PCB designers and SW engineers, control of milestones, deadlines and quality compliance • Development of schedules which accurately reflect the project milestones and adhere to them • Signal integrity analysis of high-speed circuits • Participation in the co-design of Schematic and PCBs for motherboards with Intel® engineers • Development of Schematic, high-tech PCB layout with high speed signals and mechanical parts in supercomputing area • Preparation of version controlled Gerber, Assembly and BOM files for manufacture • Design and maintain Altium database, and development of design drawings and Requirement Specifications
• Problem statement to group of PCB Design Engineers and control of time and quality compliance • Approval of technical issues with the PCB production specialists • Signal integrity analysis of high-speed circuits • Development of Schematic and high-density, high-speed complex Analog and Digital PCB for video modules • Preparation of version controlled Gerber, Assembly and BOM files for manufacture • Design and maintain Cadence database, and development of design drawings and Requirement Specifications
• Approval of technical issues with the PCB production specialists • Development of schematic and PCB layout of medical devices