Kim Gerwig
About
Kim Gerwig is from Saint Paul Minnesota. Kim is currently Advanced Package Engineer at 3M. In Kim's previous role as a Associate Engineer - Packaging at Church & Dwight, Co., Inc., Kim worked in until Oct 2013. Prior to joining Church & Dwight, Co., Inc., Kim was a Teaching Assistant at Rochester Institute of Technology and held the position of Teaching Assistant. Prior to that, Kim was a APC Lab Assistant at Rochester Institute of Technology from Nov 2010 to May 2013. Kim started working as Structural Design and Graphics Intern at Green Bay Packaging in Jun 2012.
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