Phillip Lo Presti

Tanvas is redefining touch by enabling you to feel what you see on any touchscreen. Despite advances in graphics, sound and vibration, today’s touchscreen is still just a lifeless window to the digital world. TanvasTouch surface haptics add a new dimension of interaction that goes beyond the buzz of vibration and brings unlimited textures and feelings to flat, physical surfaces. TanvasTouch can be built into any touch-enabled product across a wide range of applications including automotive, retail, consumer electronics, visually impaired and custom displays. The combination of sensing and haptics on the same layer and its solid-state design make TanvasTouch technology unlike anything on the market today.

FRIS Technologies (www.frisic.com) is the first company to develop low C-SWaP, high-speed, wide dynamic range, multi-mode software-configurable imaging sensor platform that can potentially be a disruptive product for assisted/autonomous driving and multiple other large markets. It is a system-on-chip architecture that offers all three sensing modalities (camera, lidar, and radar) tightly integrated on the same platform. This architecture significantly simplifies sensor fusion and promises to be the “one smart sensor for the whole vehicle”. FRIS technologies can be an enabler of faster and improved perception within the sensor platform reducing decision-making time while freeing up significant processing resources, delivering high-speed capability and hybrid modality with low data bandwidth.

Advising incoming CEO and Board of Directors on key strategic initiatives with partners and customers related to expanding manufacturing capacity, joint developments, co-marketing/co-development and technology licensing.

Transformed and expanded sales, marketing and manufacturing teams leveraging existing technology and products growing business that is trending towards a $40M run rate. Created vision, mission, strategy and business plan to address a $2B market opportunity with a new product roadmap. Identified staffing requirements and expanded staff to deliver and support $100M+ revenue. Established, MRAM credibility through existing products where Everspin’s MRAM became the leading emerging memory for mission critical applications in enterprise storage, automotive and industrial markets. Negotiated a complex license and foundry agreement making Everspin the first MRAM Company to license its technology enabling embedded MRAM for the foundry industry with a groundbreaking JDA and partnership with GLOBALFOUNDRIES. This same agreement provides the production tools and capacity to support Everspin’s roadmap and business plan. Raised money through strategic investors that includes Western Digital, GLOBALFOUNDRIES and GigaDevices. Leading the team to achieve the business plan objectives and launching the industry’s first high density MRAM products, positioned the company for a successful IPO that was completed in October 2016. The IPO raised $40M with a concurrent $5M private placement for a total of $45M.

Responsible for the integration of the Kenet product line into Intersil, business development and new product development for high speed data converters.

Kenet Inc. was a fabless semiconductor specializing in low-power mixed-signal products based on its patented Femtocharge® technology and was recently acquired by Intersil (October 2008) where the product line continues to be supported. The company had developed and put in production over 50 high performance ultra lower ADCs that have been targeted and designed into a variety of applications including portable consumer, instrumentation and communications applications such as in cable head end and set top boxes. Kenet was backed by investors including Venrock Associates, Oak Investment Partners, Kopin Corporation, and CP Group.

• Responsible for business unit strategy, sales revenue ($200M+ per year) and P/L for NEC’s ASIC products in North America • Established the organization and strategy to help expand business at targeted segments and focus customers • Consistently achieved sales growth above industry averages and transitioned the business unit into a profitable organization • Coordinated strategies within NEC divisions worldwide and R&D groups to define new products to increase sales and market share with our global customers • Established a team to launch NEC’s latest ASIC products and directly promoted solutions to the press and at industry conferences • Responsible for customer relationships and strategic partnerships requiring extensive interface with IP and EDA providers as well as customers in the PC, mobile and game console graphics, servers, storage, set top box, networking and communications markets

• Responsible for sales activities in North America for most of NEC’s semiconductor products(managed over 29 sales professionals and application engineers plus 18 sales representative firms) • Responsible for business development, strategy and P/L for ASIC products and microcontrollers in North America • Managed engineering (6 regional design centers, 60 engineers), marketing (47 product marketing engineers) and customer support (27 planners) for ASIC and microcontrollers in North America and expanded business at target and existing customers • Reorganized the sales organization, updated compensation packages and updated the sales representative commission program • Aligned the incentive plans of sales, marketing and engineering to improve operational effectiveness • Created a program and project management based organization for engineering and marketing to improve customer support

• Responsible for engineering (six design centers), marketing and customer support of ASIC products for North America • Continued to increase design wins and revenue while responsible for ASIC business development, sales and P/L • Established close working relationship with the sales organization and NEC Japan to help drive the organizational objectives • Developed many close working relationships with customers at all levels

Business Manager & AGM • Responsible for business development (design wins and sales revenue) and the management of engineering (design centers), marketing and customer support for ASIC products within the eastern and central United States • Secured several major design wins which generated over $500M in revenue over several years of production • Successfully increased sales from $10M to over $150M per year • Managed mulitple design centers around the United States providing front end, back end, EDA, package and test support to North American customers

• Design Engineer for high speed test equipment