Thomas Di Stefano Ph D
About
Thomas Di Stefano Ph D is from San Jose, California, United States. Thomas works in the following industries: "Electrical/Electronic Manufacturing". Thomas is currently Co-Founder & CEO at Centipede Systems, located in San Francisco Bay Area. In Thomas's previous role as a Co-Founder and Publisher at ChipScale Review, Thomas worked in San Francisco Bay Area until Jan 1999. Prior to joining ChipScale Review, Thomas was a Co-Founder and Member of Board of Directors at Tessera and held the position of Co-Founder and Member of Board of Directors at San Francisco Bay Area. Prior to that, Thomas was a Senior Manager, Advanced Packaging at IBM Watson Research Center, based in Yorktown Heights, NY from Jan 1971 to Jan 1990.
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Thomas Di Stefano Ph D's current jobs
Centipede Systems is dedicated to developing game changing technology for testing semicoductor devices. Centipede has developed and licensed wafer probe and burn-in Technology, including the MicroTorq probe licensed to Advantest for wafer probe applications. Centipede is a pioneer in test-in-tray technology for burn-in and test of ICs. Centipede's fully automated, modular systems allow testing under controlled thermal and environmental conditions. The Company holds more than 24 US Patents on device test, contacts, and thermal management.
Thomas Di Stefano Ph D's past jobs
Co-Founder of ChipScale Review magazine. Contributed as Publisher (1998) and as a Contributing Editor. Worked with a great team of Ron Iscoff (Editor), Joe Flelstad, Vern Solberg and Gene Selvin to build the magazine into a leading publication in the field of microelectronic miniaturization.
Co-Founder and first President of Tessera Technologies (TSRA), the leader in Chip Sized Packaging technology that revolutionized the packaging world, helping make the high-performance miniaturized electronic devices of today possible. Co-inventor with Igor Khandros of the µBGA package that started the Chip Scale Package revolution. "Tessera's inventions are found in 100 percent of today's smart phones and a broad range of electronic devices from wearables to data centers. The value of this approach has allowed it to become one of the most widely proliferated package technologies in history" (from Tessera.com).
Member of the IBM Academy of Technology and member of the IBM Technology Council (1990) Corporate Recognition Award (with A. Halperin) for development and implementation of a test method for detecting latent defects in mainframe motherboards. With this test, there were zero field failures of mainframe motherboards for a decade. Scientific and Technological contributions to fields including Semiconductor Physics, Physics of Device Reliability, Semiconductor Storage, Optical Storage, and Electrical Test Technology. Initiated and Managed Research Departments: - Interface Physics - Group Manager - Communications Strategy - Technical Staff to IBM Director of Research - Optical Storage Project - Department Manager - Measurement Science - Department Manager - Advanced Packaging - Senior Manager