Tingwei Huang
About
Tingwei works in the following industries: "Semiconductors", "Internet", and "Information Technology & Services". Tingwei is currently Product Leader - ML Platform at Twitter. In Tingwei's previous role as a Head of Product - ML Inference, AWS AI at Amazon Web Services (AWS), Tingwei worked in until Sep 2021. Prior to joining Amazon Web Services (AWS), Tingwei was a Director of Product Management - Artificial Intelligence at Intel Corporation and held the position of Director of Product Management - Artificial Intelligence at San Francisco Bay Area. Prior to that, Tingwei was a Director of Business Developement - Big Data Analytics at Intel Corporation from May 2015 to Nov 2016. Tingwei started working as Group Product Manager - Data Center SSD at Intel Corporation in Jan 2015. From Aug 2012 to May 2015, Tingwei was Sr. Product Manager - Data Center SoC at Intel Corporation, based in san francisco bay area. Prior to that, Tingwei was a Investment Manager - Intel Capital at Intel Capital from Mar 2012 to Aug 2012. Tingwei started working as Technical Sales and Business Development - Cloud at Intel Corporation in Jun 2011.
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Tingwei Huang's current jobs
Tingwei Huang's past jobs
My team was in charge of delivering the best ML inference experience for AWS customers, including those running ML models on AWS and on edge (on-prem servers, mobile, or IOT) devices connected to AWS.
I led product management of Intel Nervana AI accelerator product line. Nervana was one of the first successful startups for AI accelerator chips. As the first PM of Nervana after its acquisition, I helped grew the product (10x) and engineering (30x) team in 2 years. I led strategic planning, established processes and helped the startup group scale via cross BU collaborations. I led the creation of Intel's longer term AI strategy, product roadmap, and drive the execution of deep learning accelerator hardware products and software stacks for customers from hyperscale cloud data centers to the edges. I landed early design wins with tier1 cloud service providers through high-touch business and technical collaborations. My work in jump-starting the performance optimization software effort contributed directly to $1B/yr AI/ML revenue.
I led engagements with big data analytics ecosystem partners for one of the first open source data and machine learning platform (trustedanalytics.org). I recruited cloud service providers (IaaS, PaaS, SaaS), ISVs (data prep, data processing, data analytics, data store, data visualization), and hardware OEMs to join the alliance ecosystem to drive demand and accelerate the creation of cloud native apps driven by big data analytics. I landed PoC, pilot and commercial deployments in Financial Service, Retail and IOT verticals.
I managed a group of product managers for Intel’s Data Center Solid State Drive(SSD) product line.
I brought to market the first data center SoC products at Intel. I built the Xeon D and Atom C product lines for Compute (microserver), Storage, Network, and IoT segments. As the lead PM, I led product strategy and execution from cradle to grave. This includes developing the product roadmap, product positioning, pricing, SKUing, get design wins, drive collaboration with ecosystem partners (OEM/ODM/ISV/Cloud), go-to-market, and launch. In this role, I gained deep knowledge of compute, storage and network building blocks for Cloud, Enterprise IT, HPC and Big Data infrastructure.
I made equity investments in startups in mobile compute ecosystem, including mobile app, touch controllers, batteries and other phone/tablet/PC components.
I drove design wins with hyperscale cloud service providers like AWS, Google and Facebook. I brokered deals and helped these hyperscale customers transition from buying standard off-the-shelf servers to buying custom servers from Taiwanese ODMs at a lower cost. To ramp up and educate the ecosystem, I hosted large-scale industry events, led executive meetings, and managed customer co-marketing activities.
I created and managed marketing programs for netbooks and tablets in emerging markets, including Latin America, Africa, South East Europe and Asia.
I designed IP blocks for microprocessor chips. I led the transition of silicon design flow through 3 process generations. I evaluated design automation software and hardware library IPs and negotiated with the vendors.