William Capen
About
William Capen is from Kansas City Metropolitan Area. William is currently Chairperson at IPC, located in United States. William also works as Engineering Technical Specialist at Honeywell FM & T, a job William has held since Aug 2018. In William's previous role as a Midwest Engineering Sales at SemiPack Services Inc., William worked in until Aug 2018. Prior to joining SemiPack Services Inc., William was a Senior Manufacturing Engineer III at DRS Technologies, Inc. and held the position of Senior Manufacturing Engineer III at Johnstown, Pennsylvania Area. Prior to that, William was a PCB Assembly Engineer at SAIC from Jul 2015 to Aug 2015. William started working as Mfg Engineer II at Benchmark Electronics, Inc. in Rochester, Minnesota Area in Dec 2013. From Apr 2011 to Dec 2013, William was MFG Engineer at Cobham Mission Systems, based in Davenport, Iowa Area. Prior to that, William was a SMT Process Engineer at Debron Industrial Electronics, based in Troy MI from Sep 2010 to Mar 2011. William started working as senior Manufacturing Engineering Technian at Rockwell Automation in Apr 2008.
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