Zebin Huang
About
Zebin Huang is from San Diego California United States of America. Zebin is currently Principal Electrical Engineer at SAIC. In Zebin's previous role as a Principal Hardware Engineer at Northrop Grumman, Zebin worked in until Mar 2021. Prior to joining Northrop Grumman, Zebin was a Mixed Signal Product and Test Development Engineer at Qualcomm and held the position of Mixed Signal Product and Test Development Engineer. Prior to that, Zebin was a Hardware Engineer and Bench Test Lead at Qualcomm from Jul 2007 to Nov 2015. Zebin started working as Intern and Hardware Engineer at LinkQuest Inc in Dec 2004.
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